Boiling enhancement
Accelerates bubble departure and liquid replenishment to improve two-phase heat transfer.
A two-phase cold plate solution for direct-to-chip cooling of next-generation chips
Synthcool Landau™ 2PCP uses the high latent heat of two-phase cooling to deliver higher heat-transfer efficiency and temperature uniformity than conventional single-phase liquid cooling. This direct-to-chip cooling solution supports In-Row and In-Rack deployment, with water-side or air-side primary heat rejection.
Application scenarioUp to 250 W/cm² heat flux and PUE as low as 1.05, supporting current and next-generation chip cooling.
Turning high-density cooling into stable, controllable, and deployable systems.
Phase-state control
Monitors dryness and inlet/outlet phase states to maintain balanced flow distribution.
Low-pressure circulation
1/3 the flow rate of traditional water-cooled cold plates cuts pumping power and costs. Patented components dynamically control coolant flow based on load changes.
Insulated and leak-safe
An insulating, nonflammable dielectric fluid prevents short circuits, contamination, and fire risks from leakage.
Technical specifications
Model
- Model
- Landau™ 2PCP-160
- Frame size
- H2200mm × W600mm × D1200mm
- Rated heat exchange
- 160 kW
Phase-change cold plate compute node
- Chassis
- 10U / 1RU
- Size
- 21-inch, 48mm × W536mm × D768mm
- Configuration
- GPU board, supports 8-card OAM; supports NVIDIA SXM cards
- Coolant
- R1233zd(E) / R245fa / R1336mzz(Z) / R515B
- Installation
- Blind mate / manual insertion
- Rated capacity per card
- ≥2600W
- Rated flow
- 0.48 LPM/kW
- Rated saturation temperature / pressure
- 45°C / 2.52 bar
- Inlet subcooling
- 2°C
- Outlet dryness
- 0.5
Power distribution
- Rated input voltage
- Dual 220V-50Hz / optional 380V-3PH-50HZ
- Dual power support
- Dual power supply supported, optional ATS
- Switch type
- 16A
Phase-change RDU
- CDU form
- In Rack
- Pump
- Standard 1+1 redundant pumps, optional single pump
- Rated supply flow
- 80 LPM
- Condensing temperature / pressure
- 43°C / 2.38 bar
- Primary-side heat exchange
- Water-cooled, optional air-cooled
- Primary-side temperature range
- 10-35°C
- System pressure rating
- 6 bar
- Reservoir volume
- 5L
- Filter precision
- 500 mesh
- Rated power
- 1.2kW
- HMI
- 10.5-inch touch display (local) Standard RS485 interface, protocol: Modbus RTU Optional gateway with multiple network interfaces, protocol: Modbus-TCP
- Maintenance clearance
- Front/back 1600mm or maintenance side; front/back clearance not less than 1200mm
Environment
- Operating temperature
- 15~40°C
- Operating relative humidity
- 8%~80%RH
- Altitude
- ≤2000m
- Storage temperature
- -25~60°C
- Storage relative humidity
- 5%~95%RH
