芯寒智能

Products

SynthCool Landau™Two-phase cold plate coolingSynthCool Landau™Two-phase immersion coolingSynthCool Stokes™Coolant distribution units (CDUs)SynthCool Nusselt™Single-phase cold plate coolingSynthCool Onsager™Single-phase immersion coolingSynthCoolData center AI control system
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Landau™

Two-phase cold plate cooling

Core specifications for the 2PCP series in high heat-flux compute scenarios.

Parameter2PCP-1602PCP-512
Rated heat exchange160kW512kW
Frame size2200x600x1200mm2200x1200x1200mm
CoolantR1233zd(E) / R245fa / R1336mzz(Z) / R515BR1233zd(E) / R245fa / R1336mzz(Z) / R515B
RDUIn Rack or In Row, standard 1+1 redundant pumpsIn Rack or In Row, standard 1+1 redundant pumps
Primary sideWater-cooled or air-cooled, natural cooling supportedWater-cooled or air-cooled, natural cooling supported
Power distributionDual 220-50Hz, optional 380V-3PH-50HZDual 220-50Hz, optional 380V-3PH-50HZ
CommunicationModbus RTU, optional Modbus-TCPModbus RTU, optional Modbus-TCP
EnvironmentOperating: 15~40°C, 8%~80%RH Storage: -25~60°C, 9%~95%RHOperating: 15~40°C, 8%~80%RH Storage: -25~60°C, 9%~95%RH
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Landau™

Two-phase immersion cooling

Core specifications of the 2PIC series for rack-level immersion liquid cooling.

Parameter2PIC-400
Rated heat exchange400kW
Frame size2200x600x1600mm (cabinet) 2200x1200x1600mm (CDU)
Secondary-side coolantNovec 649 / HFP-D / 2P50
Secondary-side pumpStandard 1+1 redundant pumps
Primary sideAllowed inlet temperature 15-35°C Rated inlet temperature 35/43°C
Power distribution3ph-380Vac 50Hz / 5-wire incoming (3P+N+PE), dual power supply
CommunicationModbus RTU, optional Modbus-TCP
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Stokes™

Coolant distribution units (CDUs)

Core CDU specifications for medium- and high-power liquid cooling systems.

ParameterCDU-L2A-160CDU-L2L2000CDU-L2L-2500
Rated heat exchange160kW2000kW2500kW
Frame size2200x1200x1200mm2360x1650x1200mm2400x1200x1200mm
Secondary-side coolant-Deionized water / EG25 / PG25Deionized water / EG25 / PG25
Secondary-side temperatureRated supply/return 45/55°CRated supply/return 35/51°CRated supply/return 35/51°C
Primary-side coolantAirSoftened water, supports up to 30% glycol solutionSoftened water, supports up to 30% glycol solution
Primary-side temperatureAllowed air temperature 5-35°C Rated air temperature 35°CAllowed inlet temperature 15-32°C Rated inlet temperature 32/48°CAllowed inlet temperature 15-32°C Rated inlet temperature 32/48°C
Power distribution380V-3PH-50HZ380V-3PH-50HZ380V-3PH-50HZ
CommunicationModbus RTU, optional Modbus-TCPModbus RTU, optional Modbus-TCPModbus RTU, optional Modbus-TCP
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Nusselt™

Single-phase cold plate cooling

A cold plate matrix for GPUs, CPUs, high-speed interconnects, and memory.

ModelNvidia GB300Nvidia GB200Nvidia H200Nvidia 5090AMD SP5Huawei Ascend 300i GPUOSFP 1.6TDIMM
Heat loadGPU1400W*4 +CPU576W*21200W+1200W +300W8x700W+2x134W +2x156W575W550W*2350W45W (1.6T) / 11W (800G)30 W / DIMM
MaterialCopper T1 (high purity)Copper T2Copper T2Copper cold plate, aluminum frameCopper T26063 aluminum, 1060 aluminumCopper T2Nickel-plated copper
ProcessTransient liquid phase bondingTransient liquid phase bondingContinuous hydrogen-protected brazing tunnel furnaceTransient liquid phase bondingTransient liquid phase bondingFriction stir weldingContinuous hydrogen-protected brazing tunnel furnaceContinuous hydrogen-protected brazing tunnel furnace
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Onsager™

Single-phase immersion cooling

Core specifications of the 1PIC series for Tank + CDU configurations.

Parameter1PIC-50
Rated heat exchange50kW
Frame size1350x1250x900mm (TANK) 2100x600x900mm (CDU)
Secondary-side coolantFluorinated liquid / silicone oil
Secondary-side pumpStandard 1+1 redundant pumps
Secondary-side temperatureRated supply/return temperature 35/45°C
Primary-side temperatureAllowed inlet temperature 15-31°C Rated inlet temperature 32/37°C
Power distributionDual 220V-50Hz / optional 380V-3PH-50HZ
CommunicationModbus RTU, optional Modbus-TCP
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SynthCool

Data center AI control system

An intelligent control platform spanning data processing, predictive decisions, and room-level coordination.

  • AI-driven intelligent decision-making
  • Full-function system management
  • Flexible configuration options
  • Integrated hardware-software delivery