A two-phase cold plate cooling solution for next-generation chips

Synthcool Landau™ 2PCP uses the high latent heat of two-phase cooling to deliver higher heat-transfer efficiency and temperature uniformity than conventional single-phase liquid cooling. It supports In-Row and In-Rack deployment, with water-side or air-side primary heat rejection.

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Application scenario250 W/cm² heat flux and 1.05 PUE, supporting current and next-generation chip cooling.

Turning high-density cooling into stable, controllable, and deployable systems.

Boiling enhancement

Accelerates bubble departure and liquid replenishment to improve two-phase heat transfer.

Phase-state control

Monitors dryness and inlet/outlet phase states to maintain balanced flow distribution.

Low-pressure circulation

1/3 the flow rate of traditional water-cooled cold plates reduces pumping power and component costs.

Insulated and leak-safe

An insulating, nonflammable dielectric fluid prevents short circuits, contamination, and fire risks from leakage.

Technical specifications

Model

Model
Landau™ 2PIC-400
Frame size
2200×600×1600mm (cabinet) 2200×1200×1600mm (CDU)
Rated heat exchange
400 kW

Phase-change immersion compute node

Form factor
Supports 19-inch servers / 21-inch servers
Configuration
Supports 8-card OAM
Heat dissipation per card
≥1500W@OAM
Rated flow
0.34 LPM/kW@HFP-D
Operating pressure
101±10kPa@HFP-D
Cooling method
Phase-change immersion liquid cooling
Ambient temperature requirement
Operation 10°C~40°C / storage -40~60°C

Phase-change immersion compute cabinet

Frame size
2240×600×1600mm
Available space
44 OU / 48RU
Power unit
Centralized power modules can be located at top and bottom Supports up to four 54V power boxes, up to 432kW 24 PSUs support N+1 / N+N redundancy
Liquid/gas interface
Drip-free self-locking blind-mate connectors UQD804 4 rows×10 pcs, DN20 4 rows×10 pcs
Supported servers
40 vertical servers (4 rows×10 groups 1U)
Installation
Floor-standing installation, base installation

Phase-change RDU

Pump
1+1 dual pumps / single pump (optional)
Coolant
Novec 649 / HFP-D / 2P50
Primary-side coolant
Softened water / PG25 / EG30
Allowed inlet temperature
15-35°C
Rated inlet/outlet temperature
35/43°C
Rated coolant flow
44m³/h
Inlet / outlet pipe diameter
DN80
Connection type
DIN flange
System pressure rating
10bar
Filter precision
Primary side 300 mesh
Hydraulic requirement
1~1.5bar
Power requirement
3ph-380Vac 50Hz / 5-wire incoming (3P+N+PE), dual power supply
HMI
7-inch touch display (local) Standard RS485 interface, protocol: Modbus RTU RJ45 network interface, protocol: Modbus-TCP
Maintenance clearance
Front/back maintenance clearance not less than equipment depth

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